Effects of gold on the properties of tin-antimony solder in flip-chip-pin-grid-array (FCGPA) packages

See Bee Kee; Luay B Hussain; Kesavan Nair; YL Khong; Dennis Chandran Prem Kumar

doi:10.4071/1551-4897-2.4.281

Kee, See Bee, Luay B Hussain, Kesavan Nair, YL Khong, and Dennis Chandran Prem Kumar. 2005. “Effects of Gold on the Properties of Tin-Antimony Solder in Flip-Chip-Pin-Grid-Array (FCGPA) Packages.” Journal of Microelectronics and Electronic Packaging 2 (4): 281–86. https://doi.org/10.4071/1551-4897-2.4.281.

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Effects of gold on the properties of tin-antimony solder in flip-chip-pin-grid-array (FCGPA) packages

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