ISSN 1551-4897
Vol. 2, Issue 4, 2005October 01, 2005 EDT
Effects of gold on the properties of tin-antimony solder in flip-chip-pin-grid-array (FCGPA) packages
Effects of gold on the properties of tin-antimony solder in flip-chip-pin-grid-array (FCGPA) packages
Kee, See Bee, Luay B Hussain, Kesavan Nair, YL Khong, and Dennis Chandran Prem Kumar. 2005. “Effects of Gold on the Properties of Tin-Antimony Solder in Flip-Chip-Pin-Grid-Array (FCGPA) Packages.” Journal of Microelectronics and Electronic Packaging 2 (4): 281–86. https://doi.org/10.4071/1551-4897-2.4.281.