Vol. 2, Issue 4, 2005October 01, 2005 EDT
Reliability of anisotropic conductive joints for bumpless flip-chip on flex packages under thermal stresses
Reliability of anisotropic conductive joints for bumpless flip-chip on flex packages under thermal stresses
Ali, Lafir, Y. C. Chan, and M.O. Alam. 2005. “Reliability of Anisotropic Conductive Joints for Bumpless Flip-Chip on Flex Packages under Thermal Stresses.” Journal of Microelectronics and Electronic Packaging 2 (4): 269–80. https://doi.org/10.4071/1551-4897-2.4.269.