Vol. 2, Issue 1, 2005January 01, 2005 EDT
Modeling Thermal Behavior of System-in-Package with Dynamic Compact Model
Modeling Thermal Behavior of System-in-Package with Dynamic Compact Model
Kaija, Kimmo, Pekka Heino, and Eero O. Ristolainen. 2005. “Modeling Thermal Behavior of System-in-Package with Dynamic Compact Model.” Journal of Microelectronics and Electronic Packaging 2 (1): 64–71. https://doi.org/10.4071/1551-4897-2.1.64.