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Vol. 16, Issue 2, 2019April 01, 2019 EDT

Sixty Earth-Day Test of a Prototype Pt/HTCC Alumina Package in a Simulated Venus Environment

Liangyu Chen, Philip G. Neudeck, Roger D. Meredith, Dorothy Lukco, David J. Spry, Leah M. Nakley, Kyle G. Phillips, Glenn M. Beheim, Gary W. Hunter,
High temperaturepackagingHTCCSiCelectronicsVenus
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.873073
Journal of Microelectronics & Elect Pkg
Chen, Liangyu, Philip G. Neudeck, Roger D. Meredith, Dorothy Lukco, David J. Spry, Leah M. Nakley, Kyle G. Phillips, Glenn M. Beheim, and Gary W. Hunter. 2019. “Sixty Earth-Day Test of a Prototype Pt/HTCC Alumina Package in a Simulated Venus Environment.” Journal of Microelectronics and Electronic Packaging 16 (2): 78–83. https:/​/​doi.org/​10.4071/​imaps.873073.
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