Vol. 17, Issue 3, 2020July 01, 2020 EDT
Development of High Thermally Conductive Die Attach for TIM Applications
Development of High Thermally Conductive Die Attach for TIM Applications
Patelka, Maciej, Sho Ikeda, Koji Sasaki, Hiroki Myodo, and Nortisuka Mizumura. 2020. “Development of High Thermally Conductive Die Attach for TIM Applications.” Journal of Microelectronics and Electronic Packaging 17 (3): 106–9. https://doi.org/10.4071/imaps.1125402.