Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder Balls

Vishnu V. B. Reddy; Jaimal Williamson; Suresh K. Sitaraman

doi:10.4071/imaps.1501802

Reddy, Vishnu V. B., Jaimal Williamson, and Suresh K. Sitaraman. 2021. “Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder Balls.” Journal of Microelectronics and Electronic Packaging 18 (4): 183–89. https://doi.org/10.4071/imaps.1501802.

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