Vol. 18, Issue 4, 2021October 01, 2021 EDT
Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder Balls
Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder Balls
Reddy, Vishnu V. B., Jaimal Williamson, and Suresh K. Sitaraman. 2021. “Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder Balls.” Journal of Microelectronics and Electronic Packaging 18 (4): 183–89. https://doi.org/10.4071/imaps.1501802.