Vol. 17, Issue 2, 2020April 01, 2020 EDT
Fabrication of Ceramic Interposers for Module Packaging
Fabrication of Ceramic Interposers for Module Packaging
Alizadeh, Rana, Kaoru Uema Porter, Tom Cannon, and H. Alan Mantooth. 2020. “Fabrication of Ceramic Interposers for Module Packaging.” Journal of Microelectronics and Electronic Packaging 17 (2): 67–72. https://doi.org/10.4071/imaps.1114553.