This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Skip to main content
null
Journal of Microelectronics & Elect Pkg
  • Menu
  • Articles
    • General
    • Technical Article
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • IMAPSource Proceedings
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:51057/feed
ISSN 1551-4897
General
Vol. 17, Issue 2, 2020April 01, 2020 EDT

Fabrication of Ceramic Interposers for Module Packaging

Rana Alizadeh, Kaoru Uema Porter, Tom Cannon, H. Alan Mantooth,
Ceramic interposerdouble-sided power modulelow-temperature cofired ceramic (LTCC)3D ceramic printing
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.1114553
Journal of Microelectronics & Elect Pkg
Alizadeh, Rana, Kaoru Uema Porter, Tom Cannon, and H. Alan Mantooth. 2020. “Fabrication of Ceramic Interposers for Module Packaging.” Journal of Microelectronics and Electronic Packaging 17 (2): 67–72. https:/​/​doi.org/​10.4071/​imaps.1114553.

View more stats

Powered by Scholastica, the modern academic journal management system