Collective Cu-Cu Thermocompression Bonding Using Pillars

Robert Carroll; Douglas La Tulipe; Douglas Coolbaugh; Robert Geer

doi:10.4071/imaps.741710

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Carroll, Robert, Douglas La Tulipe, Douglas Coolbaugh, and Robert Geer. 2019. “Collective Cu-Cu Thermocompression Bonding Using Pillars.” Journal of Microelectronics and Electronic Packaging 16 (1): 28–38. https://doi.org/10.4071/imaps.741710.

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