Vol. 16, Issue 1, 2019January 01, 2019 EDT
A Numerical Study on Mitigation of Flying Dies in Compression Molding of Microelectronic Packages
A Numerical Study on Mitigation of Flying Dies in Compression Molding of Microelectronic Packages
Dreissigacker, Marc, Ole Hoelck, Joerg Bauer, Tanja Braun, Karl-Friedrich Becker, Martin Schneider-Ramelow, and Klaus-Dieter Lang. 2019. “A Numerical Study on Mitigation of Flying Dies in Compression Molding of Microelectronic Packages.” Journal of Microelectronics and Electronic Packaging 16 (1): 39–44. https://doi.org/10.4071/imaps.763387.