ISSN 1551-4897
Vol. 16, Issue 1, 2019January 01, 2019 EDT
A Numerical Study on Mitigation of Flying Dies in Compression Molding of Microelectronic Packages
A Numerical Study on Mitigation of Flying Dies in Compression Molding of Microelectronic Packages
Articles in Vol. 16, Issue 1, 2019
Vol. 16, Issue 1, 2019
- Elevated Standoff Heights of Solder Joint Interconnections Can Result in Appreciable Stress and Warpage ReliefEphraim SuhirSung YiJennie S. HwangReza Ghaffarian
- FCCSP IMC Growth under Reliability Stress Following Automotive StandardsWei-Wei Liu (Xenia)Berdy WengJerry LiCing-Kun Yeh
- Collective Cu-Cu Thermocompression Bonding Using PillarsRobert CarrollDouglas La TulipeDouglas CoolbaughRobert Geer
- A Numerical Study on Mitigation of Flying Dies in Compression Molding of Microelectronic PackagesMarc DreissigackerOle HoelckJoerg BauerTanja BraunKarl-Friedrich BeckerMartin Schneider-RamelowKlaus-Dieter Lang
- Design of Solder Connections for Self-Assembly of Optoelectronic DevicesThomas F. MarinisJoseph W. Soucy
Dreissigacker, Marc, Ole Hoelck, Joerg Bauer, Tanja Braun, Karl-Friedrich Becker, Martin Schneider-Ramelow, and Klaus-Dieter Lang. 2019. “A Numerical Study on Mitigation of Flying Dies in Compression Molding of Microelectronic Packages.” Journal of Microelectronics and Electronic Packaging 16 (1): 39–44. https://doi.org/10.4071/imaps.763387.