Vol. 17, Issue 2, 2020April 01, 2020 EDT
Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging
Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging
Thomas, Tina, Marius van Dijk, Marc Dreissigacker, Stefan Hoffmann, Hans Walter, Karl-Friedrich Becker, and Martin Schneider-Ramelow. 2020. “Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging.” Journal of Microelectronics and Electronic Packaging 17 (2): 35–44. https://doi.org/10.4071/imaps.1064487.