Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging

Thomas, Tina, Marius van Dijk, Marc Dreissigacker, Stefan Hoffmann, Hans Walter, Karl-Friedrich Becker, and Martin Schneider-Ramelow. 2020. “Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging.” Journal of Microelectronics and Electronic Packaging 17 (2): 35–44. https:/​/​doi.org/​10.4071/​imaps.1064487.