Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging

Tina Thomas; Marius van Dijk; Marc Dreissigacker; Stefan Hoffmann; Hans Walter; Karl-Friedrich Becker; Martin Schneider-Ramelow

doi:10.4071/imaps.1064487

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Thomas, Tina, Marius van Dijk, Marc Dreissigacker, Stefan Hoffmann, Hans Walter, Karl-Friedrich Becker, and Martin Schneider-Ramelow. 2020. “Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging.” Journal of Microelectronics and Electronic Packaging 17 (2): 35–44. https://doi.org/10.4071/imaps.1064487.

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