ISSN 1551-4897
Vol. 17, Issue 2, 2020April 01, 2020 EDT
Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging
Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging
Articles in Vol. 17, Issue 2, 2020
Vol. 17, Issue 2, 2020
- Ferrites in Transfer-Molded Power SiPs: Challenges in PackagingTina ThomasMarius van DijkMarc DreissigackerStefan HoffmannHans WalterKarl-Friedrich BeckerMartin Schneider-Ramelow
- High-Temperature Electronics Packaging for Simulated Venus ConditionArdalan NasiriSimon S. AngTom CannonErrol V. PorterKaoru Uema PorterCaitlin ChapinRuiqi ChenDebbie G. Senesky
- Assembly of Cu Wirings with Ultrasmooth and High-Adhesive Electroless Cu Seed Layer by Using UV Modification and Low Attenuation of High-Frequency Transmission PropertyMasaya TobaShuji NomotoNobuhito KomuroKazuyuki MitsukuraShinichiro AbeTakashi MasukoKazuhiko Kurafuchi
- A Wirebonding Instrument for Insulated and Coaxial WiresMitchell MeinholdCaprice GrayJeffery DelisioErnest KimChristian WellsDaniela TorresPeter LewisDavid Hagerstrom
- Fabrication of Ceramic Interposers for Module PackagingRana AlizadehKaoru Uema PorterTom CannonH. Alan Mantooth
Thomas, Tina, Marius van Dijk, Marc Dreissigacker, Stefan Hoffmann, Hans Walter, Karl-Friedrich Becker, and Martin Schneider-Ramelow. 2020. “Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging.” Journal of Microelectronics and Electronic Packaging 17 (2): 35–44. https://doi.org/10.4071/imaps.1064487.