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Vol. 16, Issue 1, 2019January 01, 2019 EDT

Design of Solder Connections for Self-Assembly of Optoelectronic Devices

Thomas F. Marinis, Joseph W. Soucy,
Optoelectronicsolder bumpsurface tensionself-assembly
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.739404
Journal of Microelectronics & Elect Pkg
Marinis, Thomas F., and Joseph W. Soucy. 2019. “Design of Solder Connections for Self-Assembly of Optoelectronic Devices.” Journal of Microelectronics and Electronic Packaging 16 (1): 1–12. https:/​/​doi.org/​10.4071/​imaps.739404.
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