Skip to main content
null
Journal of Microelectronics & Elect Pkg
  • Menu
  • Articles
    • General
    • Technical Article
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • IMAPSource Proceedings
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:44347/feed
General
Vol. 16, Issue 3, 2019July 01, 2019 EDT

Design and Demonstration of Glass Panel Embedding for 3D System Packages for Heterogeneous Integration Applications

Siddharth Ravichandran, Shuhei Yamada, Tomonori Ogawa, Tailong Shi, Fuhan Liu, Vanessa Smet, Venky Sundaram, Rao Tummala,
Embeddingglass panel embedding3D SiPheterogeneous integrationpanel fan-outFOWLP
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.930748
Journal of Microelectronics & Elect Pkg
Ravichandran, Siddharth, Shuhei Yamada, Tomonori Ogawa, Tailong Shi, Fuhan Liu, Vanessa Smet, Venky Sundaram, and Rao Tummala. 2019. “Design and Demonstration of Glass Panel Embedding for 3D System Packages for Heterogeneous Integration Applications.” Journal of Microelectronics and Electronic Packaging 16 (3): 124–35. https:/​/​doi.org/​10.4071/​imaps.930748.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system