Vol. 16, Issue 3, 2019July 01, 2019 EDT
Design and Demonstration of Glass Panel Embedding for 3D System Packages for Heterogeneous Integration Applications
Design and Demonstration of Glass Panel Embedding for 3D System Packages for Heterogeneous Integration Applications
Ravichandran, Siddharth, Shuhei Yamada, Tomonori Ogawa, Tailong Shi, Fuhan Liu, Vanessa Smet, Venky Sundaram, and Rao Tummala. 2019. “Design and Demonstration of Glass Panel Embedding for 3D System Packages for Heterogeneous Integration Applications.” Journal of Microelectronics and Electronic Packaging 16 (3): 124–35. https://doi.org/10.4071/imaps.930748.