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Vol. 2, Issue 1, 2005January 01, 2005 EDT

A New Method of Determining the Thermal Resistance of Microelectronic Packages

King-Long Teoh, K.N. Seetharamu, Ahmad Yusoff Hassan,
Thermal resistanceJEDECfootprintjunction temperature
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/1551-4897-2.1.84
Journal of Microelectronics & Elect Pkg
Teoh, King-Long, K.N. Seetharamu, and Ahmad Yusoff Hassan. 2005. “A New Method of Determining the Thermal Resistance of Microelectronic Packages.” Journal of Microelectronics and Electronic Packaging 2 (1): 84–97. https:/​/​doi.org/​10.4071/​1551-4897-2.1.84.
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