Vol. 2, Issue 1, 2005January 01, 2005 EDT
A New Method of Determining the Thermal Resistance of Microelectronic Packages
A New Method of Determining the Thermal Resistance of Microelectronic Packages
Teoh, King-Long, K.N. Seetharamu, and Ahmad Yusoff Hassan. 2005. “A New Method of Determining the Thermal Resistance of Microelectronic Packages.” Journal of Microelectronics and Electronic Packaging 2 (1): 84–97. https://doi.org/10.4071/1551-4897-2.1.84.