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Vol. 2, Issue 2, 2005April 01, 2005 EDT

Engineering Model for Interfacial Stresses of a Heated Bimaterial Structure with Bond Material Used in Electronic Packages

D. Sujan, M. V. V. Murthy, K. N. Seetharamu, A. Y. Hassan,
Shearing StressPeeling StressBondLinear Temperature GradientDieDie AttachCoefficient of Thermal Expansion
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/1551-4897-2.2.132
Journal of Microelectronics & Elect Pkg
Sujan, D., M. V. V. Murthy, K. N. Seetharamu, and A. Y. Hassan. 2005. “Engineering Model for Interfacial Stresses of a Heated Bimaterial Structure with Bond Material Used in Electronic Packages.” Journal of Microelectronics and Electronic Packaging 2 (2): 132–41. https:/​/​doi.org/​10.4071/​1551-4897-2.2.132.
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