Vol. 2, Issue 2, 2005April 01, 2005 EDT
Engineering Model for Interfacial Stresses of a Heated Bimaterial Structure with Bond Material Used in Electronic Packages
Engineering Model for Interfacial Stresses of a Heated Bimaterial Structure with Bond Material Used in Electronic Packages
Sujan, D., M. V. V. Murthy, K. N. Seetharamu, and A. Y. Hassan. 2005. “Engineering Model for Interfacial Stresses of a Heated Bimaterial Structure with Bond Material Used in Electronic Packages.” Journal of Microelectronics and Electronic Packaging 2 (2): 132–41. https://doi.org/10.4071/1551-4897-2.2.132.