ISSN 1551-4897
Vol. 17, Issue 3, 2020July 01, 2020 EDT
High-Density Interconnect Technology Assessment of Printed Circuit Boards for Space Applications
High-Density Interconnect Technology Assessment of Printed Circuit Boards for Space Applications
Cauwe, Maarten, Bart Vandevelde, Chinmay Nawghane, Marnix Van De Slyeke, Erwin Bosman, Joachim Verhegge, Alexia Coulon, and Stan Heltzel. 2020. “High-Density Interconnect Technology Assessment of Printed Circuit Boards for Space Applications.” Journal of Microelectronics and Electronic Packaging 17 (3): 79–88. https://doi.org/10.4071/imaps.1212898.