Lead Free Die Mount Adhesive Using Silver Nanoparticles Applied To Power Discrete Package

Yasunari Ukita; Kazuki Tateyama; Masao Segawa; Yoshihiko Tojo; Hideyuki Gotoh; Katsuhisa Oosako

doi:10.4071/1551-4897-2.3.217

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Ukita, Yasunari, Kazuki Tateyama, Masao Segawa, Yoshihiko Tojo, Hideyuki Gotoh, and Katsuhisa Oosako. 2005. “Lead Free Die Mount Adhesive Using Silver Nanoparticles Applied To Power Discrete Package.” Journal of Microelectronics and Electronic Packaging 2 (3): 217–22. https://doi.org/10.4071/1551-4897-2.3.217.

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