Vol. 2, Issue 3, 2005July 01, 2005 EDT
Lead Free Die Mount Adhesive Using Silver Nanoparticles Applied To Power Discrete Package
Lead Free Die Mount Adhesive Using Silver Nanoparticles Applied To Power Discrete Package
Ukita, Yasunari, Kazuki Tateyama, Masao Segawa, Yoshihiko Tojo, Hideyuki Gotoh, and Katsuhisa Oosako. 2005. “Lead Free Die Mount Adhesive Using Silver Nanoparticles Applied To Power Discrete Package.” Journal of Microelectronics and Electronic Packaging 2 (3): 217–22. https://doi.org/10.4071/1551-4897-2.3.217.