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Vol. 2, Issue 1, 2005
January 01, 2005 EDT
Advanced Assembly Techniques For Silicon Sensors
Zbigniew Szczepański
,
Jerzy Kalenik
,
backside contacts
flip chip bonding
silicon sensors
underfilling
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ccby-nc-nd-4.0
•
https://doi.org/10.4071/1551-4897-2.1.8
Journal of Microelectronics & Elect Pkg
Szczepański, Zbigniew, and Jerzy Kalenik. 2005. “Advanced Assembly Techniques For Silicon Sensors.”
Journal of Microelectronics and Electronic Packaging
2 (1): 8–13.
https://doi.org/10.4071/1551-4897-2.1.8
.
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