Shear Strength Degradation Modeling of Lead-Free Solder Joints at Different Isothermal Aging Conditions

Hani, Dania Bani, Raed Al Athamneh, Mohammed Aljarrah, and Sa’d Hamasha. 2021. “Shear Strength Degradation Modeling of Lead-Free Solder Joints at Different Isothermal Aging Conditions.” Journal of Microelectronics and Electronic Packaging 18 (3): 137–44. https:/​/​doi.org/​10.4071/​imaps.1423793.