Vol. 18, Issue 3, 2021July 01, 2021 EDT
Shear Strength Degradation Modeling of Lead-Free Solder Joints at Different Isothermal Aging Conditions
Shear Strength Degradation Modeling of Lead-Free Solder Joints at Different Isothermal Aging Conditions
Hani, Dania Bani, Raed Al Athamneh, Mohammed Aljarrah, and Sa’d Hamasha. 2021. “Shear Strength Degradation Modeling of Lead-Free Solder Joints at Different Isothermal Aging Conditions.” Journal of Microelectronics and Electronic Packaging 18 (3): 137–44. https://doi.org/10.4071/imaps.1423793.