ISSN 1551-4897
Vol. 18, Issue 3, 2021July 01, 2021 EDT
Shear Strength Degradation Modeling of Lead-Free Solder Joints at Different Isothermal Aging Conditions
Shear Strength Degradation Modeling of Lead-Free Solder Joints at Different Isothermal Aging Conditions
Articles in Vol. 18, Issue 3, 2021
Vol. 18, Issue 3, 2021
- A SiC Double-Sided Stacked Wire-Bondless Power Module for High-Frequency Power Electronic ApplicationsSi HuangZhong Chen
- Shear Strength Degradation Modeling of Lead-Free Solder Joints at Different Isothermal Aging ConditionsDania Bani HaniRaed Al AthamnehMohammed AljarrahSa’d Hamasha
- Thermal and Reliability Characterization of an Epoxy Resin-Based Double-Side Cooled Power ModuleTzu-Hsuan ChengKenji NishiguchiYoshi FukawaB. Jayant BaligaSubhashish BhattacharyaDouglas C. Hopkins
- Mechanical Properties and Interface Microstructure of SAC305 Solder Joints Made to an Ag-Pd-Pt Thick Film Metallization: Part 1—Processing EffectsPaul T. ViancoAlice C. KilgoBonnie B. McKenzieShelley WilliamsRobert FerrizzCurtis Co
- Mechanical Properties and Interface Microstructure of SAC305 Solder Joints Made to a Ag-Pd-Pt Thick Film Metallization: Part 2—Isothermal Aging EffectsPaul. T. ViancoAlice. C. KilgoBonnie. B. McKenzieShelley WilliamsRobert FerrizzCurtis Co
Hani, Dania Bani, Raed Al Athamneh, Mohammed Aljarrah, and Sa’d Hamasha. 2021. “Shear Strength Degradation Modeling of Lead-Free Solder Joints at Different Isothermal Aging Conditions.” Journal of Microelectronics and Electronic Packaging 18 (3): 137–44. https://doi.org/10.4071/imaps.1423793.