Vol. 17, Issue 2, 2020April 01, 2020 EDT
Assembly of Cu Wirings with Ultrasmooth and High-Adhesive Electroless Cu Seed Layer by Using UV Modification and Low Attenuation of High-Frequency Transmission Property
Assembly of Cu Wirings with Ultrasmooth and High-Adhesive Electroless Cu Seed Layer by Using UV Modification and Low Attenuation of High-Frequency Transmission Property
Masaya Toba, Shuji Nomoto, Nobuhito Komuro, Kazuyuki Mitsukura, Shinichiro Abe, Takashi Masuko, Kazuhiko Kurafuchi,
Toba, Masaya, Shuji Nomoto, Nobuhito Komuro, Kazuyuki Mitsukura, Shinichiro Abe, Takashi Masuko, and Kazuhiko Kurafuchi. 2020. “Assembly of Cu Wirings with Ultrasmooth and High-Adhesive Electroless Cu Seed Layer by Using UV Modification and Low Attenuation of High-Frequency Transmission Property.” Journal of Microelectronics and Electronic Packaging 17 (2): 45–51. https://doi.org/10.4071/imaps.1100914.