Vol. 18, Issue 2, 2021April 01, 2021 EDT
The Effect of Cu Target Pad Roughness and Solution Flow on the Growth Mode and Void Formation in Electroless Cu Films
The Effect of Cu Target Pad Roughness and Solution Flow on the Growth Mode and Void Formation in Electroless Cu Films
Bernhard, Tobias, Sebastian Zarwell, Roger Massey, Edith Steinhäuser, Stefan Kempa, and Frank Branduuml. 2021. “The Effect of Cu Target Pad Roughness and Solution Flow on the Growth Mode and Void Formation in Electroless Cu Films.” Journal of Microelectronics and Electronic Packaging 18 (2): 40–50. https://doi.org/10.4071/imaps.1409209.