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Vol. 18, Issue 3, 2021July 01, 2021 EDT

Thermal and Reliability Characterization of an Epoxy Resin-Based Double-Side Cooled Power Module

Tzu-Hsuan Cheng, Kenji Nishiguchi, Yoshi Fukawa, B. Jayant Baliga, Subhashish Bhattacharya, Douglas C. Hopkins,
Double-side coolingepoxy resin composite dielectrichalf-bridge power modulepower electronic packagingthermal modelingthermal-mechanical modeling
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.1427774
Journal of Microelectronics & Elect Pkg
Cheng, Tzu-Hsuan, Kenji Nishiguchi, Yoshi Fukawa, B. Jayant Baliga, Subhashish Bhattacharya, and Douglas C. Hopkins. 2021. “Thermal and Reliability Characterization of an Epoxy Resin-Based Double-Side Cooled Power Module.” Journal of Microelectronics and Electronic Packaging 18 (3): 123–36. https:/​/​doi.org/​10.4071/​imaps.1427774.
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