ISSN 1551-4897
Vol. 18, Issue 3, 2021July 01, 2021 EDT
Thermal and Reliability Characterization of an Epoxy Resin-Based Double-Side Cooled Power Module
Thermal and Reliability Characterization of an Epoxy Resin-Based Double-Side Cooled Power Module
Tzu-Hsuan Cheng, Kenji Nishiguchi, Yoshi Fukawa, B. Jayant Baliga, Subhashish Bhattacharya, Douglas C. Hopkins,
Articles in Vol. 18, Issue 3, 2021
Vol. 18, Issue 3, 2021
- A SiC Double-Sided Stacked Wire-Bondless Power Module for High-Frequency Power Electronic ApplicationsSi HuangZhong Chen
- Shear Strength Degradation Modeling of Lead-Free Solder Joints at Different Isothermal Aging ConditionsDania Bani HaniRaed Al AthamnehMohammed AljarrahSa’d Hamasha
- Thermal and Reliability Characterization of an Epoxy Resin-Based Double-Side Cooled Power ModuleTzu-Hsuan ChengKenji NishiguchiYoshi FukawaB. Jayant BaligaSubhashish BhattacharyaDouglas C. Hopkins
- Mechanical Properties and Interface Microstructure of SAC305 Solder Joints Made to an Ag-Pd-Pt Thick Film Metallization: Part 1—Processing EffectsPaul T. ViancoAlice C. KilgoBonnie B. McKenzieShelley WilliamsRobert FerrizzCurtis Co
- Mechanical Properties and Interface Microstructure of SAC305 Solder Joints Made to a Ag-Pd-Pt Thick Film Metallization: Part 2—Isothermal Aging EffectsPaul. T. ViancoAlice. C. KilgoBonnie. B. McKenzieShelley WilliamsRobert FerrizzCurtis Co
Cheng, Tzu-Hsuan, Kenji Nishiguchi, Yoshi Fukawa, B. Jayant Baliga, Subhashish Bhattacharya, and Douglas C. Hopkins. 2021. “Thermal and Reliability Characterization of an Epoxy Resin-Based Double-Side Cooled Power Module.” Journal of Microelectronics and Electronic Packaging 18 (3): 123–36. https://doi.org/10.4071/imaps.1427774.