ISSN 1551-4897
Vol. 18, Issue 3, 2021July 01, 2021 EDT
Thermal and Reliability Characterization of an Epoxy Resin-Based Double-Side Cooled Power Module
Thermal and Reliability Characterization of an Epoxy Resin-Based Double-Side Cooled Power Module
Tzu-Hsuan Cheng, Kenji Nishiguchi, Yoshi Fukawa, B. Jayant Baliga, Subhashish Bhattacharya, Douglas C. Hopkins,
Cheng, Tzu-Hsuan, Kenji Nishiguchi, Yoshi Fukawa, B. Jayant Baliga, Subhashish Bhattacharya, and Douglas C. Hopkins. 2021. “Thermal and Reliability Characterization of an Epoxy Resin-Based Double-Side Cooled Power Module.” Journal of Microelectronics and Electronic Packaging 18 (3): 123–36. https://doi.org/10.4071/imaps.1427774.