Vol. 15, Issue 4, 2018October 01, 2018 EDT
Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration
Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration
Cheng-Ta Ko, Henry Yang, John Lau, Ming Li, Margie Li, Curry Lin, J. W. Lin, Chieh-Lin Chang, Jhih-Yuan Pan, Hsing-Hui Wu, Yu-Hua Chen, Tony Chen, Iris Xu, Penny Lo, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Chia-Hung Lin, Rozalia Beica, Marc Lin, Cao Xi, Sze Pei Lim, Ning Cheng Lee, Mian Tao, Jeffery Lo, Ricky Lee,
Ko, Cheng-Ta, Henry Yang, John Lau, Ming Li, Margie Li, Curry Lin, J. W. Lin, et al. 2018. “Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration.” Journal of Microelectronics and Electronic Packaging 15 (4): 141–47. https://doi.org/10.4071/imaps.734552.