Reliability of Fan-Out Wafer-Level Heterogeneous Integration

John Lau; Ming Li; Yang Lei; Margie Li; Iris Xu; Tony Chen; Qing X. Yong; Zhong Cheng; Wu Kai; Penny Lo; Zhang Li; Kim H. Tan; Yiu Ming Cheung; Nelson Fan; Eric Kuah; Cao Xi; Jiang Ran; Rozalia Beica; Sze P. Lim; Ning Cheng Lee; Cheng-Ta Ko; Henry Yang; Yu-Hua Chen; Mian Tao; Jeffery Lo; Ricky Lee

doi:10.4071/imaps.728940

Lau, John, Ming Li, Yang Lei, Margie Li, Iris Xu, Tony Chen, Qing X. Yong, et al. 2018. “Reliability of Fan-Out Wafer-Level Heterogeneous Integration.” Journal of Microelectronics and Electronic Packaging 15 (4): 148–62. https://doi.org/10.4071/imaps.728940.

View more stats