Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration

John H. Lau; Cheng-Ta Ko; Chia-Yu Peng; Kai-Ming Yang; Tim Xia; Puru Bruce Lin; Jean-Jou Chen; Po-Chun Huang; Tzvy-Jang Tseng; Eagle Lin; Leo Chang; Curry Lin; Winnie Lu

doi:10.4071/imaps.1137828

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Lau, John H., Cheng-Ta Ko, Chia-Yu Peng, Kai-Ming Yang, Tim Xia, Puru Bruce Lin, Jean-Jou Chen, et al. 2020. “Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration.” Journal of Microelectronics and Electronic Packaging 17 (3): 89–98. https://doi.org/10.4071/imaps.1137828.

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