Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration

Lau, John H., Cheng-Ta Ko, Chia-Yu Peng, Kai-Ming Yang, Tim Xia, Puru Bruce Lin, Jean-Jou Chen, et al. 2020. “Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration.” Journal of Microelectronics and Electronic Packaging 17 (3): 89–98. https:/​/​doi.org/​10.4071/​imaps.1137828.