Vol. 16, Issue 4, 2019October 01, 2019 EDT
Stackable SiC-Embedded Ceramic Packages for High-Voltage and High-Temperature Power Electronic Applications
Stackable SiC-Embedded Ceramic Packages for High-Voltage and High-Temperature Power Electronic Applications
Hoang Linh Bach, Daniel Dirksen, Christoph Blechinger, Tobias Maximilian Endres, Christoph Friedrich Bayer, Andreas Schletz, Martin März,
Bach, Hoang Linh, Daniel Dirksen, Christoph Blechinger, Tobias Maximilian Endres, Christoph Friedrich Bayer, Andreas Schletz, and Martin März. 2019. “Stackable SiC-Embedded Ceramic Packages for High-Voltage and High-Temperature Power Electronic Applications.” Journal of Microelectronics and Electronic Packaging 16 (4): 176–81. https://doi.org/10.4071/imaps.952440.