Vol. 16, Issue 4, 2019October 01, 2019 EDT
Process Optimization and Implementation of Online Monitoring Process in the Transfer Molding for Electronic Packaging
Process Optimization and Implementation of Online Monitoring Process in the Transfer Molding for Electronic Packaging
Kaya, Burcu, Jan-Martin Kaiser, Karl-Friedrich Becker, Tanja Braun, and Klaus-Dieter Lang. 2019. “Process Optimization and Implementation of Online Monitoring Process in the Transfer Molding for Electronic Packaging.” Journal of Microelectronics and Electronic Packaging 16 (4): 157–75. https://doi.org/10.4071/imaps.954402.