ISSN 1551-4897
Vol. 16, Issue 4, 2019October 01, 2019 EDT
Process Optimization and Implementation of Online Monitoring Process in the Transfer Molding for Electronic Packaging
Process Optimization and Implementation of Online Monitoring Process in the Transfer Molding for Electronic Packaging
Articles in Vol. 16, Issue 4, 2019
Vol. 16, Issue 4, 2019
- Process Optimization and Implementation of Online Monitoring Process in the Transfer Molding for Electronic PackagingBurcu KayaJan-Martin KaiserKarl-Friedrich BeckerTanja BraunKlaus-Dieter Lang
- Stackable SiC-Embedded Ceramic Packages for High-Voltage and High-Temperature Power Electronic ApplicationsHoang Linh BachDaniel DirksenChristoph BlechingerTobias Maximilian EndresChristoph Friedrich BayerAndreas SchletzMartin März
- Fabrication of Highly Reliable Joint Based on Cu/Ni/Sn Double-Layer Powder for High Temperature ApplicationHongyan XuYaochun ShenYihua HuJianqiang LiJu Xu
- Rapid and Localized Soldering Using Reactive Films for Electronic ApplicationsRabih KhazakaDonatien MartineauToni YoussefThanh Long LeStéphane Azzopardi
Kaya, Burcu, Jan-Martin Kaiser, Karl-Friedrich Becker, Tanja Braun, and Klaus-Dieter Lang. 2019. “Process Optimization and Implementation of Online Monitoring Process in the Transfer Molding for Electronic Packaging.” Journal of Microelectronics and Electronic Packaging 16 (4): 157–75. https://doi.org/10.4071/imaps.954402.