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Journal of Microelectronics & Elect Pkg
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ISSN 1551-4897
General
Vol. 2, Issue 4, 2005October 01, 2005 EDT

Electrical approach to Nondestructive Analysis on WB-PBGA with TDR Technology

Ming-Kun Chen, Cheng-Chi Tai, Yu-Jung Huang,
Time Domain Reflectometry (TDR)nondestructive analysis (NA)wire-bonded plastic ball grid array (WB-PBGA)
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/1551-4897-2.4.240
Journal of Microelectronics & Elect Pkg
Chen, Ming-Kun, Cheng-Chi Tai, and Yu-Jung Huang. 2005. “Electrical Approach to Nondestructive Analysis on WB-PBGA with TDR Technology.” Journal of Microelectronics and Electronic Packaging 2 (4): 240–52. https:/​/​doi.org/​10.4071/​1551-4897-2.4.240.

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