Vol. 2, Issue 4, 2005October 01, 2005 EDT
Electrical approach to Nondestructive Analysis on WB-PBGA with TDR Technology
Electrical approach to Nondestructive Analysis on WB-PBGA with TDR Technology
Chen, Ming-Kun, Cheng-Chi Tai, and Yu-Jung Huang. 2005. “Electrical Approach to Nondestructive Analysis on WB-PBGA with TDR Technology.” Journal of Microelectronics and Electronic Packaging 2 (4): 240–52. https://doi.org/10.4071/1551-4897-2.4.240.