Electrical approach to Nondestructive Analysis on WB-PBGA with TDR Technology

Ming-Kun Chen; Cheng-Chi Tai; Yu-Jung Huang

doi:10.4071/1551-4897-2.4.240

Loading [Contrib]/a11y/accessibility-menu.js

Chen, Ming-Kun, Cheng-Chi Tai, and Yu-Jung Huang. 2005. “Electrical Approach to Nondestructive Analysis on WB-PBGA with TDR Technology.” Journal of Microelectronics and Electronic Packaging 2 (4): 240–52. https://doi.org/10.4071/1551-4897-2.4.240.

View more stats