Vol. 16, Issue 1, 2019January 01, 2019 EDT
Elevated Standoff Heights of Solder Joint Interconnections Can Result in Appreciable Stress and Warpage Relief
Elevated Standoff Heights of Solder Joint Interconnections Can Result in Appreciable Stress and Warpage Relief
Suhir, Ephraim, Sung Yi, Jennie S. Hwang, and Reza Ghaffarian. 2019. “Elevated Standoff Heights of Solder Joint Interconnections Can Result in Appreciable Stress and Warpage Relief.” Journal of Microelectronics and Electronic Packaging 16 (1): 13–20. https://doi.org/10.4071/imaps.735566.