Process Design Kit and Design Automation for Flexible Hybrid Electronics

Tsung-Ching Huang; Ting Lei; Leilai Shao; Sridhar Sivapurapu; Madhavan Swaminathan; Zhenan Bao; Kwang-Ting Cheng; Raymond Beausoleil

doi:10.4071/imaps.925849

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Huang, Tsung-Ching, Ting Lei, Leilai Shao, Sridhar Sivapurapu, Madhavan Swaminathan, Zhenan Bao, Kwang-Ting Cheng, and Raymond Beausoleil. 2019. “Process Design Kit and Design Automation for Flexible Hybrid Electronics.” Journal of Microelectronics and Electronic Packaging 16 (3): 117–23. https://doi.org/10.4071/imaps.925849.

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