Process Design Kit and Design Automation for Flexible Hybrid Electronics

Huang, Tsung-Ching, Ting Lei, Leilai Shao, Sridhar Sivapurapu, Madhavan Swaminathan, Zhenan Bao, Kwang-Ting Cheng, and Raymond Beausoleil. 2019. “Process Design Kit and Design Automation for Flexible Hybrid Electronics.” Journal of Microelectronics and Electronic Packaging 16 (3): 117–23. https:/​/​doi.org/​10.4071/​imaps.925849.