Vol. 16, Issue 3, 2019July 01, 2019 EDT
Process Design Kit and Design Automation for Flexible Hybrid Electronics
Process Design Kit and Design Automation for Flexible Hybrid Electronics
Huang, Tsung-Ching, Ting Lei, Leilai Shao, Sridhar Sivapurapu, Madhavan Swaminathan, Zhenan Bao, Kwang-Ting Cheng, and Raymond Beausoleil. 2019. “Process Design Kit and Design Automation for Flexible Hybrid Electronics.” Journal of Microelectronics and Electronic Packaging 16 (3): 117–23. https://doi.org/10.4071/imaps.925849.