Board Level Power Cycling and Thermal Cycling Fatigue Reliability of Chip-scale Packages

Tong Hong Wang; Yi-Shao Lai; Chang-Chi Lee

doi:10.4071/1551-4897-2.3.171

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Wang, Tong Hong, Yi-Shao Lai, and Chang-Chi Lee. 2005. “Board Level Power Cycling and Thermal Cycling Fatigue Reliability of Chip-Scale Packages.” Journal of Microelectronics and Electronic Packaging 2 (3): 171–79. https://doi.org/10.4071/1551-4897-2.3.171.

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