Vol. 2, Issue 3, 2005July 01, 2005 EDT
Board Level Power Cycling and Thermal Cycling Fatigue Reliability of Chip-scale Packages
Board Level Power Cycling and Thermal Cycling Fatigue Reliability of Chip-scale Packages
Wang, Tong Hong, Yi-Shao Lai, and Chang-Chi Lee. 2005. “Board Level Power Cycling and Thermal Cycling Fatigue Reliability of Chip-Scale Packages.” Journal of Microelectronics and Electronic Packaging 2 (3): 171–79. https://doi.org/10.4071/1551-4897-2.3.171.