ISSN 1551-4897
Vol. 2, Issue 3, 2005July 01, 2005 EDT
Study of Interfacial Delamination by Considering the Effect of Temperature and Moisture during Solder Reflow for QFN Package
Study of Interfacial Delamination by Considering the Effect of Temperature and Moisture during Solder Reflow for QFN Package
Wong, Fu-Mauh, and K.N Seetharamu. 2005. “Study of Interfacial Delamination by Considering the Effect of Temperature and Moisture during Solder Reflow for QFN Package.” Journal of Microelectronics and Electronic Packaging 2 (3): 197–207. https://doi.org/10.4071/1551-4897-2.3.197.