Skip to main content
null
Journal of Microelectronics & Elect Pkg
  • Menu
  • Articles
    • General
    • Technical Article
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • IMAPSource Proceedings
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:8241/feed
ISSN 1551-4897
General
Vol. 18, Issue 2, 2021April 01, 2021 EDT

Electroless Plating with UV Modification for Thermosetting Dielectric and Decay Suppression of High Frequency Transmission Property

Masaya Toba, Kazuyuki Mitsukura, Masaki Yamaguchi,
Printed circuit boardthermosetting dielectricelectroless Cu platinghigh frequency transmission property
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.1404105
Journal of Microelectronics & Elect Pkg
Toba, Masaya, Kazuyuki Mitsukura, and Masaki Yamaguchi. 2021. “Electroless Plating with UV Modification for Thermosetting Dielectric and Decay Suppression of High Frequency Transmission Property.” Journal of Microelectronics and Electronic Packaging 18 (2): 51–58. https:/​/​doi.org/​10.4071/​imaps.1404105.

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

cookies
cookies
cookies
Powered by Scholastica, the modern academic journal management system