Vol. 2, Issue 3, 2005July 01, 2005 EDT
Interfacial Stresses in a Tri-Material Assembly Subjected to Differential Temperatures in the Layers in Electronic Packaging
Interfacial Stresses in a Tri-Material Assembly Subjected to Differential Temperatures in the Layers in Electronic Packaging
Sujan, D., M. V. V. Murthy, K. N. Seetharamu, and A. Y. Hassan. 2005. “Interfacial Stresses in a Tri-Material Assembly Subjected to Differential Temperatures in the Layers in Electronic Packaging.” Journal of Microelectronics and Electronic Packaging 2 (3): 162–70. https://doi.org/10.4071/1551-4897-2.3.162.