ISSN 1551-4897
Vol. 16, Issue 4, 2019October 01, 2019 EDT
Rapid and Localized Soldering Using Reactive Films for Electronic Applications
Rapid and Localized Soldering Using Reactive Films for Electronic Applications
Khazaka, Rabih, Donatien Martineau, Toni Youssef, Thanh Long Le, and Stéphane Azzopardi. 2019. “Rapid and Localized Soldering Using Reactive Films for Electronic Applications.” Journal of Microelectronics and Electronic Packaging 16 (4): 182–87. https://doi.org/10.4071/imaps.955217.