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Vol. 2, Issue 3, 2005
July 01, 2005 EDT
Design of Drop Test Apparatus for Electronic Packages
Chang-Lin Yeh
,
Yi-Shao Lai
,
Drop test
Pulse
Peak acceleration
Duration
Finite Element Analysis (FEM)
Surface Mount
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ccby-nc-nd-4.0
•
https://doi.org/10.4071/1551-4897-2.3.180
Journal of Microelectronics & Elect Pkg
Yeh, Chang-Lin, and Yi-Shao Lai. 2005. “Design of Drop Test Apparatus for Electronic Packages.”
Journal of Microelectronics and Electronic Packaging
2 (3): 180–88.
https://doi.org/10.4071/1551-4897-2.3.180
.
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