Vol. 16, Issue 4, 2019October 01, 2019 EDT
Fabrication of Highly Reliable Joint Based on Cu/Ni/Sn Double-Layer Powder for High Temperature Application
Fabrication of Highly Reliable Joint Based on Cu/Ni/Sn Double-Layer Powder for High Temperature Application
Xu, Hongyan, Yaochun Shen, Yihua Hu, Jianqiang Li, and Ju Xu. 2019. “Fabrication of Highly Reliable Joint Based on Cu/Ni/Sn Double-Layer Powder for High Temperature Application.” Journal of Microelectronics and Electronic Packaging 16 (4): 188–95. https://doi.org/10.4071/imaps.960671.