FCCSP IMC Growth under Reliability Stress Following Automotive Standards

Wei-Wei Liu (Xenia); Berdy Weng; Jerry Li; Cing-Kun Yeh

doi:10.4071/imaps.735545

Liu (Xenia), Wei-Wei, Berdy Weng, Jerry Li, and Cing-Kun Yeh. 2019. “FCCSP IMC Growth under Reliability Stress Following Automotive Standards.” Journal of Microelectronics and Electronic Packaging 16 (1): 21–27. https://doi.org/10.4071/imaps.735545.

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