Vol. 16, Issue 1, 2019January 01, 2019 EDT
FCCSP IMC Growth under Reliability Stress Following Automotive Standards
FCCSP IMC Growth under Reliability Stress Following Automotive Standards
Liu (Xenia), Wei-Wei, Berdy Weng, Jerry Li, and Cing-Kun Yeh. 2019. “FCCSP IMC Growth under Reliability Stress Following Automotive Standards.” Journal of Microelectronics and Electronic Packaging 16 (1): 21–27. https://doi.org/10.4071/imaps.735545.