ISSN 1551-4897
Vol. 15, Issue 3, 2018July 01, 2018 EDT
Thermal Stress Analysis for High CRI LED Indoor Lighting Module
Thermal Stress Analysis for High CRI LED Indoor Lighting Module
Lee, Jonghwan, and Ki-Youn Kwon. 2018. “Thermal Stress Analysis for High CRI LED Indoor Lighting Module.” Journal of Microelectronics and Electronic Packaging 15 (3): 126–31. https://doi.org/10.4071/imaps.655549.
