Thermal Stress Analysis for High CRI LED Indoor Lighting Module

Jonghwan Lee; Ki-Youn Kwon

doi:10.4071/imaps.655549

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Lee, Jonghwan, and Ki-Youn Kwon. 2018. “Thermal Stress Analysis for High CRI LED Indoor Lighting Module.” Journal of Microelectronics and Electronic Packaging 15 (3): 126–31. https://doi.org/10.4071/imaps.655549.

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