Loading [Contrib]/a11y/accessibility-menu.js
Skip to main content
Journal of Microelectronics & Elect Pkg
Menu
Articles
General
Technical Article
All
For Authors
Editorial Board
About
Issues
IMAPSource Proceedings
search
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsjmep.org/feed
×
General
Vol. 17, Issue 3, 2020
July 01, 2020 EDT
High-Temperature Double-Layer Ceramic Packaging Substrates
Ardalan Nasiri
,
Simon S. Ang
,
High-temperature electronics packaging substrate
ceramic insulator
double-layer packaging substrate
Copyright Logo
ccby-nc-nd-4.0
•
https://doi.org/10.4071/imaps.1123535
Journal of Microelectronics & Elect Pkg
Nasiri, Ardalan, and Simon S. Ang. 2020. “High-Temperature Double-Layer Ceramic Packaging Substrates.”
Journal of Microelectronics and Electronic Packaging
17 (3): 99–105.
https://doi.org/10.4071/imaps.1123535
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats
