ISSN 1551-4897
Vol. 16, Issue 2, 2019April 01, 2019 EDT
Experimental Studies of Electronics Cooling Capabilities at High Altitude
Experimental Studies of Electronics Cooling Capabilities at High Altitude
Jhang, Han-Yun, Ming-Xi Ho, Cho-Han Lee, and Fang-Shou Lee. 2019. “Experimental Studies of Electronics Cooling Capabilities at High Altitude.” Journal of Microelectronics and Electronic Packaging 16 (2): 84–90. https://doi.org/10.4071/imaps.871683.