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Vol. 16, Issue 2, 2019April 01, 2019 EDT

Experimental Studies of Electronics Cooling Capabilities at High Altitude

Han-Yun Jhang, Ming-Xi Ho, Cho-Han Lee, Fang-Shou Lee,
Altitudeelectronics coolingairflowpressure dropcase temperature
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.871683
Journal of Microelectronics & Elect Pkg
Jhang, Han-Yun, Ming-Xi Ho, Cho-Han Lee, and Fang-Shou Lee. 2019. “Experimental Studies of Electronics Cooling Capabilities at High Altitude.” Journal of Microelectronics and Electronic Packaging 16 (2): 84–90. https:/​/​doi.org/​10.4071/​imaps.871683.
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