Vol. 17, Issue 1, 2020January 01, 2020 EDT
High Temperature and High Reliability Performance of Electrically Conductive Film Adhesives for RF Grounding Applications
High Temperature and High Reliability Performance of Electrically Conductive Film Adhesives for RF Grounding Applications
Zhao, Yuan, Doug Katze, John Wood, Bruno Tolla, and Howard Yun. 2020. “High Temperature and High Reliability Performance of Electrically Conductive Film Adhesives for RF Grounding Applications.” Journal of Microelectronics and Electronic Packaging 17 (1): 9–12. https://doi.org/10.4071/imaps.967309.