Vol. 18, Issue 3, 2021July 01, 2021 EDT
A SiC Double-Sided Stacked Wire-Bondless Power Module for High-Frequency Power Electronic Applications
A SiC Double-Sided Stacked Wire-Bondless Power Module for High-Frequency Power Electronic Applications
Huang, Si, and Zhong Chen. 2021. “A SiC Double-Sided Stacked Wire-Bondless Power Module for High-Frequency Power Electronic Applications.” Journal of Microelectronics and Electronic Packaging 18 (3): 113–22. https://doi.org/10.4071/imaps.1426127.