Vol. 2, Issue 3, 2005July 01, 2005 EDT
Pretreatment of Blind Via Holes before Ni/Au and Cu Plating Applied with Atmospheric Pressure Plasma Jet
Pretreatment of Blind Via Holes before Ni/Au and Cu Plating Applied with Atmospheric Pressure Plasma Jet
Sawada, Yasushi, Keiichi Yamazaki, Noriyuki Taguchi, and Tetsuji Shibata. 2005. “Pretreatment of Blind Via Holes before Ni/Au and Cu Plating Applied with Atmospheric Pressure Plasma Jet.” Journal of Microelectronics and Electronic Packaging 2 (3): 189–96. https://doi.org/10.4071/1551-4897-2.3.189.