Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging

Bijan K. Tehrani; Ryan A. Bahr; Manos M. Tentzeris

doi:10.4071/imaps.660476

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Tehrani, Bijan K., Ryan A. Bahr, and Manos M. Tentzeris. 2018. “Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless Packaging.” Journal of Microelectronics and Electronic Packaging 15 (3): 101–6. https://doi.org/10.4071/imaps.660476.

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