Vol. 2, Issue 3, 2005July 01, 2005 EDT
Soldering Properties and Interfacial Microstructure of CSP Solder Joints with Lower Melting Lead-free Solder
Soldering Properties and Interfacial Microstructure of CSP Solder Joints with Lower Melting Lead-free Solder
Atsushi Yamaguchi, Yuhei Yamashita, Akio Furusawa, Kazuto Nishida, Takashi Hojo, Yosuke Sogo, Ayako Miwa, Akio Hirose, Kojiro F. Kobayashi,
Yamaguchi, Atsushi, Yuhei Yamashita, Akio Furusawa, Kazuto Nishida, Takashi Hojo, Yosuke Sogo, Ayako Miwa, Akio Hirose, and Kojiro F. Kobayashi. 2005. “Soldering Properties and Interfacial Microstructure of CSP Solder Joints with Lower Melting Lead-Free Solder.” Journal of Microelectronics and Electronic Packaging 2 (3): 208–16. https://doi.org/10.4071/1551-4897-2.3.208.