Recent Advances and Trends in Heterogeneous Integrations

John H. Lau

doi:10.4071/imaps.780287

Lau, John H. 2019. “Recent Advances and Trends in Heterogeneous Integrations.” Journal of Microelectronics and Electronic Packaging 16 (2): 45–77. https://doi.org/10.4071/imaps.780287.

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